Credit: Fujitsu/Android Police
Liquid cooled phones are not a completely new idea, but the rumour mill is suggesting it for the upcoming Samsung Galaxy S7.
Other rumours include:
• Qualcomm Snapdragon 820 chip for improved performance – which may explain the liquid cooling references – its predecessor, the Snapdragon 810, had heat problems
• unchanged 5.1in 2,560x1,440 Super AMOLED screen
• major camera upgrade
• microSD card slot – missing from the S6
• even tougher display glass
• Android Marshmallow
• announcement at MWC (22-25 February 2016)
/ Samsung Galaxy S7 release date specifications specs price rumours same design Qualcomm's Snapdragon 820 heat could cause problems round up roundup latest rumours Galaxy S7 released release early 2016 Samsung Galaxy S6 Galaxy S5 Samsung completely change materials revamped design more modern look feel upcoming Galaxy S7 very similar design more substantial changes under the hood improvements picture quality performance boost performance Qualcomm's new Snapdragon 820 chip internal heat pipe suppliers new handset apparent overheating problems Snapdragon 810 heat pipes heat dissipation launch dates yearly release schedules launch the Galaxy S7 S7 Edge CES show Las Vegas performance design newer stronger glass panel glass cover Turtle Glass Corning Gorilla Glass top-end smartphones magnesium-based alloy chassis better heat dissipation lighter phone durability aluminium build quality stronger type of glass display 5.1in 2,560x1,440 Super AMOLED screen next-generation galaxy 4K 3,840x2,160 resolution draw more power affect battery life photos and video press-sensitive displays Apple's 3D Touch panels Synaptics' ClearForce technology force-sensitive touch interface processor chipset /
No comments:
Post a Comment